Senior Photonics Packaging Engineer for High-Speed Modules
- Pubblicato il 16/09/2026
- Milano (MI)
- Da definire
- 70.000 - 95.000
Descrizione:
Advanced Fiber Resources in San Donato Milanese is expanding its PIC development center and seeks an expert Packaging Engineer to join a growing team. You will design and develop optical/electro-optical packaging solutions for telecom, datacom and quantum photonics applications, collaborating across international teams.
We value 5+ years in relevant roles, CAD skills (SolidWorks/Creo), and strong communication.
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